Since the emergence of the computers in 1940’s, many different class of computing systems – such as microcomputers, desktop PCs, and laptops – have been introduced to meet the ever-changing market needs, as predicted by “Bell’s Law”. Along with this trend, light-weighted mobile computing devices are introduced in early 2000’s and we are now expected to be surrounded by millions/trillions of small sensing/computing systems in upcoming IoT era.
Sensor systems in IoT era are expected to be several orders of magnitude smaller in volume than that of previous era, which is generic trend with the evolution of computing systems. This means that now we are expecting to see computing systems with volume on the order of cubic cm’s or even mm’s. Recent research shows that mm-scale systems can be realized with advances in low power electronics design, packaging, and battery technologies. These miniature systems are expected to be a drive-force for unprecedented IoT applications such as implanted diagnosis sensors and pervasive environment monitoring sensors.
In this talk, the challenges for realizing the mm-scale sensor system will be reviewed. The key challenge for achieving mm-scale volume is significant power reduction on every component of the system due to the extremely limited volume of energy storage. Therefore, low power design strategy for a few core components as well as system level design approach will be presented along with recently demonstrated mm-scale sensing systems for a few applications.
Professional Activities :
- 2015.5–Present Assistant Professor, Sungkyunkwan University, Suwon, Korea
- 2012.11–2015.1 Assistant Research Scientist, University of Michigan, Michigan Intergrated Circuits Lab. (MICL), Ann Arbor, MI
- 2012.5-2012.10 Postdoctoral Research Fellow, Michigan Intergrated Circuits Lab. (MICL), Ann Arbor, MI
- 2009.6-2009.8 Visiting Scholar, IBM T.J. Watson Research Center, Yorktown Heights, NY
- 2008.5-2008.8 Graduate Technical Intern, Intel Corporation, Circuit Research Lab., Hillsboro, OR
- 2004.1-2006.7 Firmware Engineer, Siemens Automotive Systems Co., Icheon, Korea